MCP6L91/1R/2/4

DS20002141C-page 4

 2009-2019 Microchip Technology Inc.

TABLE 1-2:

AC ELECTRICAL SPECIFICATIONS

Electrical Characteristics: Unless otherwise indicated: TA = +25°C, VDD = +5.0V, VSS = GND, VCM = VSS,

VOUT  VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF (refer to Figure 1-1).

Parameters

Sym

Min

Typ

Max

Units

Conditions

AC Response

Gain Bandwidth Product

GBWP

—

10

—

MHz

Phase Margin

PM

—

65

—

°

G = +1

Slew Rate

SR

—

7

—

V/µs

Noise

Input Noise Voltage

Eni

—2.5

—

µVP-P f = 0.1 Hz to 10 Hz

Input Noise Voltage Density

eni

—9.4

—

nV/

Hz f = 10 kHz

Input Noise Current Density

ini

—3—

fA/

Hz f = 1 kHz

TABLE 1-3:

TEMPERATURE SPECIFICATIONS

Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +2.4V to +6.0V, VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

TA

-40

—

+125

°C

Operating Temperature Range

TA

-40

—

+125

°C

(Note 1)

Storage Temperature Range

TA

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5-Lead SOT-23

JA

—256

—

°C/W

Thermal Resistance, 8-Lead SOIC (150 mil)

JA

—163

—

°C/W

Thermal Resistance, 8-Lead MSOP

JA

—206

—

°C/W

Thermal Resistance, 14-Lead SOIC

JA

—120

—

°C/W

Thermal Resistance, 14-Lead TSSOP

JA

—100

—

°C/W

Note 1:

Operation must not cause TJ to exceed maximum junction temperature specification (+150°C).