TSOP372..H, TSOP374..H

www.vishay.com

Vishay Semiconductors

Rev. 2.2, 30-Mar-2021

9

Document Number: 82622

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DRY PACKING

The reel is packed in an anti-humidity bag to protect the

devices from absorbing moisture during transportation and

storage.

FINAL PACKING

The sealed reel is packed into a cardboard box.

RECOMMENDED METHOD OF STORAGE

Dry box storage is recommended as soon as the aluminum

bag has been opened to prevent moisture absorption. The

following conditions should be observed, if dry boxes are

not available:

• Storage temperature 10 °C to 30 °C

• Storage humidity

≤ 60 % RH max.

After more than 168 h under these conditions moisture

content will be too high for reflow soldering.

In case of moisture absorption, the devices will recover to

the former condition by drying under the following condition:

192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air / nitrogen)

or

96 h at 60 °C + 5 °C and < 5 % RH for all device containers

or

24 h at 125 °C + 5 °C not suitable for reel or tubes.

An EIA JEDEC® standard J-STD-020 level 3 label is included

on all dry bags.

EIA JEDEC standard J-STD-020 level 3 label is included

on all dry bags

ESD PRECAUTION

Proper storage and handling procedures should be followed

to prevent ESD damage to the devices especially when they

are removed from the antistatic shielding bag. Electrostatic

sensitive devices warning labels are on the packaging.

VISHAY SEMICONDUCTORS STANDARD

BAR CODE LABELS

The Vishay Semiconductors standard bar code labels are

printed at final packing areas. The labels are on each

packing unit and contain Vishay Semiconductors specific

data.

BAR CODE PRODUCT LABEL (example)

Aluminum bag

Label

Reel

15973

1. Calculated shelf life in sealed bag: 12 months at <40°C and <90%

relative humidity (RH)

3. After bag is opened, devices that will be subjected to reflow solder or other high

temperature process must be

4. Devices require bake, before mounting, if:

a) Humidity Indicator Card reads > 10% for level 2a - 5a devices or >60% for

level 2 devices when read at 23±5°C

b) 3a or 3b are not met

5. If baking is required, refer to IPC/JEDEC J-STD-033 for bake procedure

2. Peak package body temperature:_______________________°C

If blank, see adjacent bar code label

a) Mounted within:___________________hours of factory conditions

≤30°C/60% RH, or

b) Stored per J-STD-033

If blank, see adjacent bar code label

Bag Seal Date:_________________________________________

If blank, see adjacent bar code label

Note: Level and body temperature defined by IPC/JEDEC J-STD-020

This bag contains

MOISTURE-SENSITIVE DEVICES

Caution

If blank, see adjacent

bar code label

3

LEVEL

260

168

22650

22178