TSOP772..W, TSOP774..W

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Vishay Semiconductors

Datasheet Values Refer to PCN-OPT-1224-2022

Rev. 2.2, 19-Aug-2022

7

Document Number: 82466

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 72 h while stored

under a max. temperature of 30 °C, 60 % RH after

opening the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as

shown in the diagram. Exercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled off

22609

Drawing-No.: 6.550-5300.01-4

Issue: 4; 13.09.11

6.6 ± 0.1

1.27

3 x 1.27 = 3.81

(4 x)

(1)

(2.2)

6.8

2.35

0.5 ± 0.1

Pick and place area

0.8

1.27

3 x 1.27 = 3.81

Marking area

(0.635)

(3.25)

Center of

sensitive area

Mold residue

(3 x)

Proposed pad layout

from component side

(for reference only)

technical drawings

according to DIN

specifications

Not indicated tolerances ± 0.15

Tool separation line

Mold residue