TSOP931..DF1P, TSOP933..DF1P, TSOP935..DF1P

www.vishay.com

Vishay Semiconductors

Rev. 1.1, 05-Aug-2021

7

Document Number: 82883

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 72 h while stored

under a max. temperature of 30 °C, 60 % RH after

opening the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as

shown in the diagram. Exercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled

off

VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE

max. 120 s

max. 100 s

max. 20 s

Max. ramp up 3 °C/s

max. 260 °C

10

100

1000

10000

0

50

100

250

300

0

300

Axis Title

Time (s)

250

200

150

100

50

200

150

245 °C

217 °C

240 °C

255 °C

Max. ramp down 6 °C/s

Max. 2 cycles allowed

19800