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INTERPOSER

Solderless Contacts

CS FR051

Features and Benefits

• Compliant to CS-FR051 C&K Specification

• Starclip Contacts Technology

• Spring Loaded Contacts

• Non-Outgassing

Typical Applications

• Space equipment

• Satellites payloads

• Avionics / Military

Specification

• High performance Solderless interposers according to CS-

FR051 C&K Speciiication for space applications.

• Compatible with ESCC 3401 specification.

• Suitable for use in Space, and high performance military/

aerospace applications: Board to Board or Board to Cable

applications.

• Starclip female contact technology.

Quality Level

• Compliant to CS FR051 C&K specification.

• According to ESA/ESCC code 3401.

Process to use it

PCB recommendation:

• 2µm min Pad gold thickness.

• PCB design and thickness to be defiine with customer

according to pressure apply by spring contacts.

The assembly process to safe the good positioning between

interposer and the PCB layout is managed by customer.

Options

• Possibility to customize the interposer to be in line with

your demand (Example: Sealing ring cavity, bracket, thread,

wiring…).

• Get closer to your representative for custom design request.

Packaging

• Individual packaging.

• Traceability associated as per ESA/ESCC specifications.

• Interposers could be sold and delivered with a antistatic dust

cap in individual plastic bag.

CHARACTERISTIC

SPECIFICATION

Working Voltage (sea level) 100/200 Vrms

Rated Current

1.5 A

Contact Resistance

25 mΩ (rated current)

Insulation Resistance

5000 MΩ min

Voltage Proof

400/800 Vrms /1.0mA (leakage current)

Temperature range

-55/+125 °C

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Electrical & Mechanical Characteristics

Typical initial force: 0.35N min per contact.

Full stroke force : 2±0.3N per contact.