FEATURES
10-16 mm body sizes (common); custom body sizes available on request
Top package I/O interface flexible for various top connections (die, passives, etc.)
Wafer thinning/handling <100 μm is available
Mature Package-on-Package (PoP) platform with consistent product performance and reliability
Package technology is well established in high volume production
Stacked package heights from 0.55 mm available in a variety of configurations (see stack-up table)

Applications
Interposer PoP packages are designed for products requiring efficient memory architectures including multiple buses and increased memory density and performance, while reducing mounted area. Portable electronic products such as mobile phones, portable media players (audio/graphics processor plus memory), gaming and other mobile applications can benefit from the combination of stacked package and small footprint.