| 制造商 | 部件名 | 数据表 | 功能描述 |
 Amkor Technology |
PSVFBGA
|
251Kb / 2P |
Package on Package (PoP) Family
|
 Lite-On Technology Corp... |
LTSN-H213EGBW
|
320Kb / 15P |
ROHS/ Package in 8mm tape on 7" diameter reels/ EIA STD package
|
 Murata Manufacturing Co... |
ZRB15XR61A475KE01
|
836Kb / 24P |
Chip Monolithic Ceramic Capacitor on Interposer for General
|
|
ZRB18AR6YA475KE05
|
673Kb / 23P |
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
|
|
ZRB157R61E225KE11
|
673Kb / 23P |
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
|
|
ZRB15XR60J475ME01
|
673Kb / 23P |
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
|
|
ZRB18AR61C106ME01
|
671Kb / 23P |
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
|
|
ZRB157R61C225KE11
|
673Kb / 23P |
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
|
 HK TO-GRACE TECHNOLOGY ... |
LTW-020ZDCG-E2
|
681Kb / 11P |
Package in 12mm tape on 7
|
 Kingston Technology Far... |
04EP04-N3GM627
|
2Mb / 2P |
Embedded Package-on-Package Memory for Wearables
|