Features

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4-15 mm body size

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Package height down to 0.6 mm

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Design, assembly and test capabilities

that enable stacking combinations of

memory, logic and mixed signal type

devices in I/O counts from 50 to 1100

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Established package infrastructure

with standard CABGA and fcCSP

footprints

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Consistent product performance with

high yields and reliability

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Die overhang wire bonding

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Low loop wire bonding to 40 µm or

less

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Wafer thinning: wire bond to 40 µm,

bumped wafer to 75 µm, cu pillar

bumped wafer to 50 µm

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Pb-free, RoHS compliant and green

materials

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Passive component integration

options

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JEDEC standard outlines including

MO-192, MO-195, MO-216, MO-219

and MO-298

Interposer Package-on-Package

Amkor’s popular Interposer Package-on-Package (Interposer PoP) platform

supports fine pitch flip chip connection by either thermocompression

with non-conductive paste (TCNCP) or mass reflow with capillary underfill

(CUF). Top interposer connection is performed by thermocompression

bonding with copper core balls (CCB). The CCB connection between

the bottom substrate and interposer allows for high speed and high-

density interconnect access to interposer mounted devices. This highly

reliable package achieves low unit warpage by using mold compound

encapsulating the die in between two substrates. The top interposer allows

for significantly more top side attach flexibility vs. more restrictive Through

Mold Via (TMV®) and can be coupled with numerous types of devices

(packaged memory, passives, die, etc.).

The tight pitch connection from the bottom substrate to the interposer

allows for high-density, large quantity I/O interconnects. Interposer PoP

processing enables an increase of die size without increasing package body

size by utilizing finer pitch interconnects vs. TMV® processing.

Amkor has high volume Interposer PoP experience with the most advanced

silicon nodes down to 4 nm, and ongoing projects below 4 nm. Amkor has

assembled hundreds of millions of units to date with robust performance

for a wide range of customers.

Benefits as an Enabling Technology

Interposer PoP offers OEMs and EMS providers a flexible platform to cost

effectively integrate logic plus numerous companion devices/packages in

a 3D stacked architecture. Integration through Interposer PoP provides

technical, business and logistics benefits.

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Direct, high-density electrical connection between top and bottom

substrate allows for lower latency and higher signal speeds

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Low unit warpage is achieved through use of EMC encapsulating the die

in-between two substrates

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The top interposer allows for significantly more top side attach flexibility

vs. the more restrictive TMV® interconnect layout

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Due to the Interposer PoP package design, the top interposer can be

coupled with numerous types of devices (packaged memory, passives,

die, etc.)

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High-density, and a large quantity of I/O interconnects are enabled by

tight CCB pitch connection and top interposer fan-out routing

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Expertise in high-volume manufacturing with hundreds of millions of

units assembled

Interposer PoP

DATA SHEET | LAMINATE PRODUCTS

FEATURES

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10-16 mm body sizes (common);

custom body sizes available on

request

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Top package I/O interface flexible for

various top connections (die, passives,

etc.)

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Wafer thinning/handling <100 μm is

available

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Mature Package-on-Package (PoP)

platform with consistent product

performance and reliability

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Package technology is well established

in high volume production

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Stacked package heights from

0.55 mm available in a variety of

configurations (see stack-up table)