Applications

Interposer PoP packages are designed for products

requiring efficient memory architectures including

multiple buses and increased memory density and

performance, while reducing mounted area. Portable

electronic products such as mobile phones, portable

media players (audio/graphics processor plus memory),

gaming and other mobile applications can benefit

from the combination of stacked package and small

footprint.

Reliability Qualification

Amkor assures reliable performance by continuously

monitoring key indices.

Package Level

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Moisture resistance testing: JEDEC level 3 @ 260°C x

3 reflows

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uHAST: 130°C, 85% RH, 96 hours

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Temp/Humidity: 85°C, 85% RH, 1000 hours

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Temp cycle: -55°C/+125°C, 1000 cycles

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High temp storage: 150°C, 1000 hours

Board Level

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Thermal cycle: -40°C/+125°C, 1000 cycles

Interposer PoP

Standard Materials

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Package laminate substrate

▷ Cored and coreless available

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Chip attach

▷ Mass reflow (MR) and thermocompression (TC)

available

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Encapsulant

▷ Package: Epoxy mold compound (EMC)

▷ Die: Capillary underfill (CUF)

▷ Die: Non-conductive paste (NCP)

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Solder ball

▷ Pb-free (BGA side passives available)

▷ LGA

Process Highlights

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Die thickness: <100 μm is available

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Bump pitch: Down to 40/80 μm proven in HVM

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Wafers: 200 mm & 300 mm

Test Services

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Program generation/conversion

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Product engineering

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Dual-sided contactor system available

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Tape and reel service

Shipping

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JEDEC trays

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Tape and reel available