Data Sheet

ADRF5534

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 4 of 11

Table 2.

Parameter

Rating

Positive Supply Voltage

VCC

5.4 V

Digital Control Input Voltage

T/R

−0.3 V to VCC + 0.3 V

Digital Control Input Current

T/R

15 mA

RF Input Power

Transmit Input Power (LTE Peak, 8 dB PAR) 47.5 dBm

Receive Input Power (LTE Peak, 8 dB PAR) 12 dBm

Temperature

Storage

−65°C to +150°C

Reflow Moisture Sensitivity Level 3 (MSL3)

Rating

260°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction-to-case bottom (channel to package bottom)

thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC

Unit

CP-24-27

Receive Operation

61

°C/W

Transmit Operation

32

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for the ADRF5534

Table 4. ADRF5534, 24-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

1000

1C

CDM

500

C2

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.