REV. 0

–20–

AD6645

OUTLINE DIMENSIONS

Dimensions shown in millimeters and (inches).

52-Lead PowerQuad 4 (LQFP_ED)

(SQ-52)

0.65 (0.026)

0.38 (0.015)

0.32 (0.013)

0.22 (0.009)

12.00 (0.472) SQ

10.20 (0.402)

10.00 (0.394) SQ

9.80 (0.386)

TOP VIEW

(PINS DOWN)

40

52

1

14

13

26

27

39

7.80 (0.307)

1.60

(0.063)

MAX

VIEW A

SEATING

PLANE

0.75 (0.030)

0.60 (0.024)

0.45 (0.018)

0.15 (0.006)

0.05 (0.002)

VIEW A

0.10 (0.004)

COPLANARITY

1.45 (0.057)

1.40 (0.055)

1.35 (0.053)

40

52

1

14

13

26

27

39

EXPOSED

HEATSINK

(CENTERED)

2.35 (0.093)

2.20 (0.087)

2.05 (0.081)

(4 PLCS)

6.00 (0.236)

5.90 (0.232)

5.80 (0.228)

6.00 (0.236)

5.90 (0.232)

5.80 (0.228)

2.65 (0.104)

2.50 (0.098)

2.35 (0.093)

(4 PLCS)

BOTTOM VIEW

(PINS UP)

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER

EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

THE AD6645 POWERQUAD 4 (LQFP_ED) HAS A THERMALLY AND ELECTRICALLY CONDUCTIVE HEAT SLUG EXPOSED ON THE

BOTTOM OF THE PACKAGE WHICH CAN BE UTILIZED FOR ENHANCED THERMAL MANAGEMENT. IT IS RECOMMENDED THAT

NO UNMASKED ACTIVE PCB TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME INTO CONTACT WITH

THE GROUNDED HEAT SLUG. ALTHOUGH NOT A REQUIREMENT FOR SPECIFIED OPERATION, SOLDERING THE SLUG TO A

GROUND PLANE WITH SUFFICIENT THERMAL CAPACITY WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE. THIS

MAY PROVE BENEFICIAL IN HIGH RELIABILITY APPLICATIONS WHERE LOWER JUNCTION TEMPERATURES TYPICALLY CONTRIBUTE

TO INCREASED SEMICONDUCTOR RELIABILITY.