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M95640-DF 数据表(PDF) 47 Page - STMicroelectronics |
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M95640-DF 数据表(HTML) 47 Page - STMicroelectronics |
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47 / 53 page ![]() DocID16877 Rev 19 47/53 M95640-W M95640-R M95640-DF Package information 52 10.4 Thin WLCSP package information Figure 27. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. Table 24. Thin WLCSP- 8-bump, 1.073 x 0.959 mm, wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.300 0.315 0.330 0.0118 0.0124 0.0130 A1 - 0.115 - - 0.0045 - A2 - 0.200 - - 0.0079 - b(2) - 0.160 - - 0.0063 - D - 1.073 1.093 - 0.0422 0.0430 E - 0.959 0.979 - 0.0378 0.0385 e - 0.693 - - 0.0273 - e1 - 0.800 - - 0.0315 - e2 - 0.400 - - 0.0157 - F - 0.133 - - 0.0052 - |
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