DC–28 GHz GaAs MMIC Distributed Amplifier

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Contents

Revision History.............................................................................................................................. 3

1.1

Revision 2.0................................................................................................................................................ 3

2 Product Overview .................................................................................................................... 7

2.1

Functional Block Diagram .......................................................................................................................... 7

2.2

Applications ............................................................................................................................................... 7

2.3

Key Features............................................................................................................................................... 7

3 Electrical Specifications............................................................................................................ 8

3.1

Absolute Maximum Ratings ....................................................................................................................... 8

3.2

Typical Electrical Performance ................................................................................................................... 9

3.3

Typical Performance Curves..................................................................................................................... 10

4 Chip Outline Drawing, Die Packaging, Bond Pad, and Assembly Information ....................... 18

4.1

Chip Outline Drawing ............................................................................................................................... 18

4.2

Die Packaging Information ....................................................................................................................... 18

4.3

Bond Pad Information.............................................................................................................................. 19

4.4

Assembly Drawing.................................................................................................................................... 20

5 Handling and Die Attachment Recommendations................................................................. 21

6 Ordering Information ............................................................................................................. 22