STM8AF6366TC datasheet(88/95 Pages) STMICROELECTRONICS

88 / 95 page

Package information

STM8AF6366

88/95

DS12343 Rev 2

Device marking for LQFP32

The following figure gives an example of topside marking orientation versus pin 1 identifier

location.

Other optional marking or inset/upset marks, which identify the parts throughout supply

chain operations, are not indicated below.

Figure 50. LQFP32 marking example (package top view)

1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified

and therefore not approved for use in production. ST is not responsible for any consequences resulting

from such use. In no event will ST be liable for the customer using any of these engineering samples in

production. ST's Quality department must be contacted prior to any decision to use these engineering

samples to run a qualification activity.

11.4

Thermal characteristics

In case the maximum chip junction temperature (TJmax) specified in Table 21: General

operating conditions on page 52

is exceeded, the functionality of the device cannot be

guaranteed.

TJmax, in degrees Celsius, may be calculated using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

–TAmax is the maximum ambient temperature in °C

–

ΘJA is the package junction-to-ambient thermal resistance in ° C/W

–PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

–PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum

chip internal power.

–PI/Omax represents the maximum power dissipation on output pins

Where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level

in the application.

MS37789V1

Product

identification

(1)

Pin 1 identifier

Revision code

Date code

YWW

Standard ST logo

XXXXXX

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