STM32C011F6U6 datasheet(39/94 Pages) STMICROELECTRONICS

39 / 94 page

DS13866 Rev 3

39/94

STM32C011x4/x6

Electrical characteristics

5.3

Operating conditions

5.3.1

General operating conditions

5.3.2

Operating conditions at power-up / power-down

The parameters given in Table 24 are derived from tests performed under the ambient

temperature condition summarized in Table 23.

5.3.3

Embedded reset and power control block characteristics

The parameters given in Table 25 are derived from tests performed under the ambient

temperature conditions summarized in Table 23.

Table 23. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

VDD

Standard operating voltage

2.0(1)

3.6

VIN

I/O input voltage

-0.3

Min (VDD + 3.6, 5.5)(2)

fPCLK

APB clock frequency

MHz

Ambient temperature(3)

Suffix 6(4)

-40

°C

Suffix 7(4)

-40

105

Suffix 3(4)

-40

125

Junction temperature

Suffix 6(4)

-40

105

°C

Suffix 7(4)

-40

125

Suffix 3(4)

-40

130

1. When RESET is released functionality is guaranteed down to VPDR min.

2. For operation with voltage higher than VDD +0.3 V, the internal pull-up and pull-down resistors must be disabled.

3. The TA(max) applies to PD(max). At PD < PD(max) the ambient temperature is allowed to go higher than TA(max) provided

that the junction temperature TJ does not exceed TJ(max). Refer to Section 6.5: Thermal characteristics.

4. Temperature range digit in the order code. See Section 7: Ordering information.

Table 24. Operating conditions at power-up / power-down

Symbol

Parameter

Min

Max

Unit

tVDD

VDD rise time rate

∞

µs/V

VDD fall time rate

∞

Table 25. Embedded reset and power control block characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

tRSTTEMPO(1)

POR temporization when VDD crosses VPOR

VDD rising

270

500

µs

VPOR(1)

Power-on reset threshold

1.9

1.94

1.98

VPDR(1)

Power-down reset threshold

1.88

1.92

1.96

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