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STM32G0C1NET7X 数据表(PDF) 69 Page - STMicroelectronics

部件名 STM32G0C1NET7X
功能描述  Arm® Cortex®-M0 32-bit MCU, up to 512KB Flash, 144KB RAM,6x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V
PDF  159 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32G0C1NET7X 数据表(HTML) 69 Page - STMicroelectronics

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DS13564 Rev 4
69/159
STM32G0C1xC/xE
Electrical characteristics
124
5.3.2
Operating conditions at power-up / power-down
The parameters given in Table 25 are derived from tests performed under the ambient
temperature condition summarized in Table 24.
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 26 are derived from tests performed under the ambient
temperature conditions summarized in Table 24: General operating conditions.
VDDA
Analog supply voltage
For ADC and COMP
operation
1.62
3.6
V
For DAC operation
1.8
3.6
For VREFBUF operation
2.4
3.6
VBAT
Backup operating voltage
-
1.55
3.6
V
VIN
I/O input voltage
All except TT_xx and FT_c
-0.3
Min(VDD + 3.6, 5.5)(2)
V
TT_xx
-0.3
VDD + 0.3
FT_c
-0.3
5.0(2)
TA
Ambient temperature(3)
Suffix 6(4)
-40
85
°C
Suffix 7(4)
-40
105
Suffix 3(4)
-40
125
TJ
Junction temperature
Suffix 6(4)
-40
105
°C
Suffix 7(4)
-40
125
Suffix 3(4)
-40
130
1. When RESET is released functionality is guaranteed down to VPDR min.
2. For operation with voltage higher than VDD +0.3 V, the internal pull-up and pull-down resistors must be disabled.
3. The TA(max) applies to PD(max). At PD < PD(max) the ambient temperature is allowed to go higher than TA(max) provided
that the junction temperature TJ does not exceed TJ(max). Refer to Section 6.11: Thermal characteristics.
4. Temperature range digit in the order code. See Section 7: Ordering information.
Table 24. General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Table 25. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD slew rate
VDD rising
-
µs/V
VDD falling; ULPEN = 0
10
VDD falling; ULPEN = 1
100
ms/V
Table 26. Embedded reset and power control block characteristics
Symbol
Parameter
Conditions(1)
Min
Typ
Max
Unit
tRSTTEMPO(2)
POR temporization when VDD crosses VPOR
VDD rising
-
250
400
μs
VPOR(2)
Power-on reset threshold
-
1.62
1.66
1.70
V



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