Symbol

Pin

Parameter

Test conditions

Min.

Typ.

Max.

Unit

iLOCK_l

iLOCK

iLOCK low-level bias

current

iLOCK = GND

35

55

75

µA

iLOCK_h

iLOCK

iLOCK high-level bias

current

iLOCK = VDD

1

µA

iLOCK_pu

iLOCK

iLOCK pull-up resistor

66

90

142

kΩ

Driver buffer section

IGON

Source short-circuit

current

TJ = 25 °C

4

A

TJ = -40 / +125 °C (2)

3

5

VGONH

Source output high-level

voltage

IGON = 100 mA

VH-0.15

VH-0.125

V

RGON

Source RDS_ON

IGON = 100 mA

1.25

1.5

Ω

IGOFF

Sink short-circuit current

TJ = 25 °C

4

A

TJ = -40 / +125 °C (2)

3

5.5

VGOFFL

Sink output low-level

voltage

IGOFF = 100 mA

110

120

mV

RGOFF

Sink RDS_ON

IGOFF = 100 mA

1.1

1.2

Ω

Miller Clamp

VCLAMPth

CLAMP voltage

threshold

VCLAMP vs. GNDISO

1.3

2

2.6

V

ICLAMP

CLAMP short-circuit

current

VCLAMP = 15 V

A

TJ = 25 °C

4

TJ = -40 ÷ +125 °C (2)

2

5

VCLAMP_L

CLAMP low-level output

voltage

ICLAMP = 100 mA

96

115

mV

RCLAMP

CLAMP RDS_ON

ICLAMP = 100 mA

0.96

1.15

Ω

Overtemperature protection

TSD

Shutdown temperature (2)

170

°C

Thys

Temperature hysteresis

(2)

20

°C

Standby

tSTBY

Standby time

See Section 6.3

200

280

500

µs

tWUP

Wake-up time

See Section 6.3

10

20

35

µs

tawake

Wake-up delay

See Section 6.3

90

140

200

µs

tstbyfilt

Standby filter

See Section 6.3

200

280

800

ns

1. MT = max (|tDon(A) - tDon(B)|, |tDoff(A) - tDoff(B)|, |tDoff(A) - tDon(B)|, |tDoff(B) - tDon(A)|).

2. Characterization data, not tested in production.

STGAP2HD

Electrical characteristics

DS13652 - Rev 2

page 8/24