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© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 3.0 — 14 March 2007

4 of 28

NXP Semiconductors

SL2 ICS50/SL2 ICS51

I•CODE SLI-L/I•CODE SLI-L HC

PUBLIC

Table 1:

Quick reference data

Symbol

Description

Min

Typ[1]

Max

Unit

SL2 ICS50

I•CODE SLI- L

23.5

pF

SL2 ICS51

I•CODE SLI- L HC

97.0

pf

[1]

Typical values are not guaranteed. These values listed are at room temperature.

5. Ordering information

Table 2:

Ordering information

Type number

Package

Name

Description

Version

SL2 ICS5001EW/V1

FFC

sawn wafer 150

µm on film frame carrier

-

SL2 FCS5001 EV/DH

FCP

Flip Chip Package

-

SL2 MOS5001EV

MOA2

Module for contactless chip card ICs PLMCC-05

SOT500AA1

SL2 ICS5101EW/V1

FFC

sawn wafer 150

µm on film frame carrier

-

SL2 FCS5101 EV/DH

FCP

Flip Chip Package

-

SL2 MOS5101EV

MOA2

Module for contactless chip card ICs PLMCC-05

SOT500AA1