HCS139MS

FN3560 Rev 1.00

Page 9 of 9

September 1995

Die Characteristics

DIE DIMENSIONS:

106 mils x 108 mils x 19 mils ±1 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCS139MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCS139 is TA14309A.

(14) 2A0

(13) 2A1

(12) 2Y0

(11) 2Y1

(10) 2Y2

1A1 (3)

1Y0 (4)

1Y1 (5)

1Y2 (6)