HCS154MS

FN2479 Rev 3.00

Page 3 of 8

January 6, 2011

Absolute Maximum Ratings

Reliability Information

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V

Input Voltage Range, All Inputs . . . . . . . -0.5V to VCC +0.5V

DC Input Current, Any One Input 10mA

DC Drain Current, Any One Output 25mA

(All Voltage Reference to the VSS Terminal)

Storage Temperature Range (TSTG) . . . . . . -65°C to +150°C

Lead Temperature (Soldering 10sec) . . . . . . . . . . . +265°C

Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . +175°C

ESD Classification. . . . . . . . . . . . . . . . . . . . . . . . . . Class 1

Thermal Resistance

JA

JC

SBDIP Package . . . . . . . . . . . . . . 63°C/W

23°C/W

Ceramic Flatpack Package . . . . . . . 87°C/W

23°C/W

Maximum Package Power Dissipation at +125oC Ambient

SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . 0.79W

Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . 0.57W

If device power exceeds package dissipation capability,

provide heat sinking or derate linearly at the following rate:

SBDIP Package . . . . . . . . . . . . . . . . . . . . . . 15.9mW/°C

Ceramic Flatpack Package . . . . . . . . . . . . . . . 11.5mW/°C

Operating Conditions

Supply Voltage . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V

Input Rise and Fall Times at 4.5V VCC (TR, TF) . . . . . 100ns

MaxOperating Temperature Range (TA) . . . -55°C to +125°C

Input Low Voltage (VIL). . . . . . . . . . . . 0.0V to 30% of VCC

Input High Voltage (VIH) . . . . . . . . . . . . 70% of VCC to VCC

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact

product reliability and result in failures not covered by warranty.

DC Electrical Specifications

SYMBOL

PARAMETERS

CONDITIONS

(Note 1)

GROUP A

SUBGROUPS

TEMPERATURE

LIMITS

UNITS

MIN MAX

ICC

Quiescent Current

VCC = 5.5V,

VIN = VCC or GND

1

+25°C

-

40

µA

2, 3

+125°C, -55°C

-

750

µA

IOL

Output Current

(Sink)

VCC = 4.5V, VIH = 4.5V,

VOUT = 0.4V, VIL = 0V

1

+25°C

4.8

-

mA

2, 3

+125°C, -55°C

4.0

-

mA

IOH

Output Current

(Source)

VCC = 4.5V, VIH = 4.5V,

VOUT = VCC -0.4V,

VIL = 0V

1

+25°C

-4.8

-

mA

2, 3

+125°C, -55°C

-4.0

-

mA

VOL

Output Voltage Low VCC = 4.5V, VIH = 3.15V,

IOL = 50A, VIL = 1.35V

1, 2, 3

+25°C, +125°C, -55°C

-

0.1

V

VCC = 5.5V, VIH = 3.85V,

IOL = 50A, VIL = 1.65V

1, 2, 3

+25°C, +125°C, -55°C

-

0.1

V

VOH

Output Voltage

High

VCC = 4.5V, VIH = 3.15V,

IOH = -50A, VIL = 1.35V

1, 2, 3

+25°C, +125°C, -55°C VCC

-0.1

-V

VCC = 5.5V, VIH = 3.85V,

IOH = -50A, VIL = 1.65V

1, 2, 3

+25°C, +125°C, -55°C VCC

-0.1

-V

IIN

Input Leakage

Current

VCC = 5.5V, VIN = VCC or

GND

1

+25°C

-

0.5

µA

2, 3

+125°C, -55°C

-

5.0

µA

FN

Noise Immunity

Functional Test

VCC = 4.5V,

VIH = 0.70(VCC), (Note 2)

VIL = 0.30(VCC)

7, 8A, 8B

+25°C, +125°C, -55°C

-

-

-

NOTES:

1. All voltages reference to device GND.

2. For functional tests, VO  4.0V is recognized as a logic “1”, and VO  0.5V is recognized as a logic “0”.