HCS32MS

FN3057 Rev 1.00

Page 3 of 11

April 11, 2007

Absolute Maximum Ratings

Thermal Information

Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V

Input Voltage Range, All Inputs . . . . . . . . . . . . . -0.5V to VCC +0.5V

DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA

DC Drain Current, Any One Output . . . . . . . . . . . . . . . . . . . . ±25mA

(All Voltage Reference to the VSS Terminal)

Storage Temperature Range (TSTG). . . . . . . . . . . .-65°C to +150°C

Lead Temperature (Soldering 10sec). . . . . . . . . . . . . . . . . . . +265°C

Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C

ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1

Operating Conditions

Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V

Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . 100ns/V Max

Operating Temperature Range (TA). . . . . . . . . . . . .-55°C to +125°C

Input Low Voltage (VIL) . . . . . . . . . . . . . . . . . . .0.0V to 30% of VCC

Input High Voltage (VIH) . . . . . . . . . . . . . . . . . .70% of VCC to VCC

Thermal Resistance (Notes 1, 2)

JA

JC

SBDIP Package . . . . . . . . . . . . . . . . .

74°C/W

24°C/W

Ceramic Flatpack Package . . . . . . . . .

116°C/W

30°C/W

Maximum Package Power Dissipation at +125°C Ambient

SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.68W

Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . . .0.43W

If device power exceeds package dissipation capability, provide heat

sinking or derate linearly at the following rate:

SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13.5mW/°C

Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . .8.6mW/°C

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1.

JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

2. For

JC, the “case temp” location is the center of the exposed metal pad on the package underside.

DC Electrical Electrical Performance Characteristics

PARAMETER

SYMBOL

TEST CONDITIONS

GROUP A

SUBGROUPS

TEMP (°C)

LIMITS

MIN

MAX

UNITS

Quiescent Current

ICC

VCC = 5.5V, VIN = VCC or

GND

1+25

-

10

A

2, 3

+125, -55

-

200

A

Output Current (Sink)

IOL

VCC = 4.5V, VIH = 4.5V,

VOUT = 0.4V, VIL = 0V

1

+25

4.8

-

mA

2, 3

+125, -55

4.0

-

mA

Output Current (Source)

IOH

VCC = 4.5V, VIH = 4.5V,

VOUT = VCC -0.4V,

VIL = 0V

1+25

-4.8

-

mA

2, 3

+125, -55

-4.0

-

mA

Output Voltage Low

VOL

VCC = 4.5V, VIH = 3.15V,

IOL = 50

A, VIL = 1.35V

1, 2, 3

+25, +125, -55

-

0.1

V

VCC = 5.5V, VIH = 3.85V,

IOL = 50

A, VIL = 1.65V

1, 2, 3

+25, +125, -55

-

0.1

V

Output Voltage High

VOH

VCC = 4.5V, VIH = 3.15V,

IOH = -50

A, VIL = 1.35V

1, 2, 3

+25, +125, -55 VCC - 0.1

-

V

VCC = 5.5V, VIH = 3.85V,

IOH = -50

A, VIL = 1.65V

1, 2, 3

+25, +125, -55 VCC - 0.1

-

V

Input Leakage Current

IIN

VCC = 5.5V, VIN = VCC or

GND

1+25

-

0.5

A

2, 3

+125, -55

-

5.0

A

Noise Immunity Functional Test

FN

VCC = 4.5V, VIH = 0.70

(VCC), VIL = 0.30(VCC),

(Note 3)

7, 8A, 8B

+25, +125, -55

-

-

-

NOTES:

3. This is just to show continuing notes in the document.

4. This is a row format electrical spec table.