HTMS1301FUGSLASHAM datasheet(4/44 Pages) NXP

4 / 44 page

184430

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Product data sheet

PUBLIC

Rev. 3.0 — 18 March 2010

184430

4 of 44

NXP Semiconductors

HITAG µ

ISO 18000 transponder IC

6. Pinning information

Note: All pads except LA and LB are electrically disconnected after dicing.

Fig 2.

HITAG µ ISO 1800 - Mega bumps bondpad locations

Table 2.

HITAG µ ISO 18000 - Mega bumps dimensions

Description

Dimension

(X) chip size

550 µm

(Y) chip size

550 µm

(1) pad center to chip edge

100.5 µm

(2) pad center to chip edge

48.708 µm

(3) pad center to chip edge

180.5 µm

(4) pad center to chip edge

55.5 µm

(5) pad center to chip edge

48.508 µm

(6) pad center to chip edge

165.5 µm

Bump Size:

LA, LB

294 x 164 µm

Remaining pads

60 x 60 µm

001aaj823

(4)

(3)

(Y)

(X)

(2)

(5)

(6)

(1)

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