Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Thin Film on Silicon 2DTA High Performance Memory Bus Terminator

A

.635

(.025)

TYP.

3.81 - 3.99

(.150 - .157)

PIN 1

.21 - .31

(.008 - .012)

1.35 - 1.75

(.053 - .069)

.10 - .25

(.004 - .010)

0-8 °

.19 - .25

(.007 - .010)

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

Model

A

2QSP24

8.56 - 8.74 (.337 - .344)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MO-137.

Mechanical Characteristics

QSOP Package Dimensions

QSOP Package Power Temperature Derating Curve

Typical Part Marking

AMBIENT TEMPERATURE ( C )

°

1.0

1.25

.75

.50

.25

2QSP24

0

50

75

100

125

150

25

Represents total content. Layout may vary.

005

DTA24Q

YYWW

PRODUCT

FUNCTION

FORWARD

VOLTAGE

PIN COUNT

PACKAGE STYLE

DATE CODE

MANUFACTURER'S

TRADEMARK

PIN 1 INDICATOR

(MOLDED INDENT)

Applications

■

High speed synchronous DRAM, SGRAM, SyncLink memory bus termination

■

High speed SRAM cache

■

100 MHz PCI and AGP bus termination

■

Local bus termination for all popular microprocessors