FN9299 Rev.3.1

Page 13 of 53

May 27, 2021

ISL81601

3. Specifications

3.

Specifications

3.1

Absolute Maximum Ratings

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions can

adversely impact product reliability and result in failures not covered by warranty.

3.2

Thermal Information

Notes:

4.

JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with “direct attach”

features. See TB379.

5. For

JC, the “case temp” location is the center of the exposed metal pad on the package underside.

Parameter

Minimum

Maximum

Unit

VCC5V, EN/UVLO, FB_IN to GND

-0.3

+5.9

V

VDD to GND

-0.3

+9

V

EXTBIAS to GND

-0.3

+40

V

VIN, CS+, CS-, ISEN+, ISEN- to GND

-0.3

+70

V

BOOT1, 2/UG1, 2 to PHASE1, 2

-0.3

VDD + 0.3

V

PHASE1, 2 to GND

-5 (<20ns)/

-0.3 (DC)

+70

V

FB_OUT, SS/TRK, COMP, RT/SYNC, PLL_COMP, CLKOUT/DITHER,

BSTEN, CLKEN, OV, PGOOD, IMON_IN, IMON_OUT to GND

-0.3

VCC5V + 0.3

V

LG1/PWM_MODE, LG2/OC_MODE to GND

-0.3

VDD + 0.3

V

CS+ to CS- and ISEN+ to ISEN-

-0.3

+0.3

V

VCC5V, VDD Short-Circuit to GND Duration

1

s

ESD Ratings

Value

Unit

Human Body Model (Tested per JS-001-2017)

2

kV

Machine Model (Tested per JESD22-A115C)

150

V

Charge Device Model (Tested per JS-002-2014)

1.5

kV

Latch-Up (Tested per JESD78E; Class II, Level A, +125°C (TJ))

100

mA

Thermal Resistance (Typical)

JA (°C/W)

JC (°C/W)

32 Ld QFN Package (Notes 4, 5)29

1.2

38 Ld HTSSOP Package (Notes 4, 5)29

2

Parameter

Minimum

Maximum

Unit

Junction Temperature

-55

+150

°C

Operating Temperature

-40

+125

°C

Storage Temperature Range

-65

+150

°C

Pb-Free Reflow Profile

see TB493