S3160 – 2.5 Gbps Wide Bandwidth Transimpedance Amplifier

AMCC Confidential and Proprietary

7

Revision A – August 12, 2004

Data Sheet

DESIGN PROCEDURES

Determining Capacitor Values

Low frequency –3 dB cutoff = 1 / [2

π*400kΩ*(10pF + C

APPLICATION INFORMATION

Filtering Through RBYPASS

should be made through the RBYPASS resistor. The RBYPASS resistor and an external capacitor to ground at the

cathode of the photodiode will act as a filter to reduce this noise and dampen any resonance at the cathode of the

photodiode.

Wire Bonding and Layout Information

For best performance all GND pads should be connected and the bond wire inductance between the photodiode

and the IIN pin should be kept to below 1.5 nH – 2 nH. The back of the die is not metallized and should be con-

nected to ground or left electrically unconnected.

The outputs OUTP and OUTN should be terminated equally to prevent instabilities. Figures 4 and 5 show the differ-

ential and single-ended terminations.