Package mechanical data

STTH312

6/8

2

Package mechanical data

Epoxy meets UL94, V0

Cooling method: by conduction (C)

Figure 13. DPAK footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 5.

DPAK dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max

Min.

Max.

A

2.20

2.40

0.086

0.094

A1

0.90

1.10

0.035

0.043

A2

0.03

0.23

0.001

0.009

B

0.64

0.90

0.025

0.035

B2

5.20

5.40

0.204

0.212

C

0.45

0.60

0.017

0.023

C2

0.48

0.60

0.018

0.023

D

6.00

6.20

0.236

0.244

E

6.40

6.60

0.251

0.259

G

4.40

4.60

0.173

0.181

H

9.35

10.10

0.368

0.397

L2

0.80 typ.

0.031 typ.

L4

0.60

1.00

0.023

0.039

V2

0°

8°

0°

8°

H

L4

G

B

L2

E

B2

D

A1

R

R

C

A

C2

0.60 MIN.

V2

A2

6.7

6.7

3

3

1.6

1.6

2.3

2.3