1995 Aug 31

7

Philips Semiconductors

Product specification

NPN 2 GHz RF power transistor

BFG10; BFG10/X

List of components used in test circuit (see Fig.7)

Notes

1. American Technical Ceramics (ATC) capacitor, type 100A or other capacitor of the same quality.

COMPONENT

DESCRIPTION

VALUE

DIMENSIONS

CATALOGUE No.

C1, C9, C10, C11

multilayer ceramic chip capacitor; note 1

24 pF

C2, C3, C4, C5,

C6, C7

multilayer ceramic chip capacitor; note 1

0.86 pF

C8

multilayer ceramic chip capacitor; note 1

1.1 pF

C12, C13

electrolytic capacitor

470

µF; 10 V

2222 031 34471

C14, C15, C16

multilayer ceramic chip capacitor; note 1

10 nF

L1

stripline; note 2

length 28.5 mm

width 0.93 mm

L2

stripline; note 2

length 2.3 mm

width 0.93 mm

L3

stripline; note 2

length 3.1 mm

width 0.93 mm

L4

stripline; note 2

length 3.3 mm

width 0.93 mm

L5

stripline; note 2

length 16.3 mm

width 0.93 mm

L6

stripline; note 2

length 10 mm

width 0.93 mm

L7

stripline; note 2

length 4.4 mm

width 0.4 mm

L8

stripline; note 2

length 19.3 mm

width 0.93 mm

L9

stripline; note 2

length 19.7 mm

width 0.4 mm

L10

micro choke

T1

BD228

R1

metal film resistor

20

Ω; 0.4 W

2322 157 10209

R2

metal film resistor

530

Ω; 0.4 W

2322 157 15301