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BFG10/X 数据表(PDF) 2 Page - NXP Semiconductors

部件名 BFG10/X
功能描述  UHF power transistor
PDF  9 Pages
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制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors

BFG10/X 数据表(HTML) 2 Page - NXP Semiconductors

  BFG10/X Datasheet HTML 1Page - NXP Semiconductors BFG10/X Datasheet HTML 2Page - NXP Semiconductors BFG10/X Datasheet HTML 3Page - NXP Semiconductors BFG10/X Datasheet HTML 4Page - NXP Semiconductors BFG10/X Datasheet HTML 5Page - NXP Semiconductors BFG10/X Datasheet HTML 6Page - NXP Semiconductors BFG10/X Datasheet HTML 7Page - NXP Semiconductors BFG10/X Datasheet HTML 8Page - NXP Semiconductors BFG10/X Datasheet HTML 9Page - NXP Semiconductors  
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1995 Sep 22
2
Philips Semiconductors
Product specification
UHF power transistor
BFG10W/X
FEATURES
• High efficiency
• Small size discrete power amplifier
• 900 MHz and 1.9 GHz operating
areas
• Gold metallization ensures
excellent reliability.
APPLICATIONS
• Common emitter class-AB
operation in hand-held radio
equipment up to 1.9 GHz.
DESCRIPTION
NPN silicon planar epitaxial transistor
encapsulated in a plastic, 4-pin
dual-emitter SOT343 package.
PINNING
PIN
DESCRIPTION
1
collector
2
emitter
3
base
4
emitter
Fig.1 SOT343.
Marking code: T5.
fpage
Top view
MBK523
2
1
3
4
QUICK REFERENCE DATA
RF performance at Tamb =25 °C in a common-emitter test circuit.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note to the Limiting values and Thermal characteristics
1. Ts is the temperature at the soldering point of the collector pin.
MODE OF OPERATION
f
(GHz)
VCE
(V)
PL
(mW)
Gp
(dB)
ηc
(%)
Pulsed, class-AB, duty cycle: < 1 : 2; tp = 10 ms
1.9
3.6
200
≥5
≥50
Pulsed, class-AB, duty cycle: < 1 : 8; tp = 4.6 ms
0.9
6
650
≥10
≥50
0.9
6
360
≥12.5
≥50
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
20
V
VCEO
collector-emitter voltage
open base
10
V
VEBO
emitter-base voltage
open collector
2.5
V
IC
collector current (DC)
250
mA
IC(AV)
average collector current
250
mA
Ptot
total power dissipation
up to Ts = 102 °C; note 1
400
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
175
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-s
thermal resistance from junction to
soldering point
up to Ts = 102 °C; note 1;
Ptot = 400 mW
180
K/W



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