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BFG10/X 数据表(PDF) 3 Page - NXP Semiconductors |
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BFG10/X 数据表(HTML) 3 Page - NXP Semiconductors |
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3 / 9 page ![]() 1995 Sep 22 3 Philips Semiconductors Product specification UHF power transistor BFG10W/X CHARACTERISTICS Tj =25 °C (unless otherwise specified). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V(BR)CBO collector-base breakdown voltage open emitter; IC = 0.1 mA 20 − V V(BR)CEO collector-emitter breakdown voltage open base; IC =5mA 10 − V V(BR)EBO emitter-base breakdown voltage open collector; IE = 0.1 mA 2.5 − V ICES collector cut-off current VCE =6V; VBE =0 − 100 µA hFE DC current gain IC = 50 mA; VCE =5V 25 − Cc collector capacitance IE =ie = 0; VCB =6V; f=1MHz − 3pF Cre feedback capacitance IC = 0; VCE = 6 V; f = 1 MHz − 2pF Fig.2 Transient thermal impedance from junction to soldering point as a function of pulse time; typical values. handbook, full pagewidth MBG431 10−5 10−6 10−4 10−3 10−2 10−1 1 103 102 10 1 Zth j-a (K/W) tp (s) δ = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 t p T P t t p T δ = |
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