BLP5LA55SG

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© Ampleon Netherlands B.V. 2023. All rights reserved.

Product data sheet

Rev. 1 — 7 April 2023

7 of 20

BLP5LA55SG

Power LDMOS transistor

7.2.3 Test circuit f = 520 MHz

Printed-Circuit Board (PCB): Rogers RO4350B; height = 0.762 mm.

See Table 11 for a list of components.

Fig 3.

Component layout for test circuit f = 520 MHz

Table 11.

List of components

See Figure 3 for component layout.

Component

Description

Value

Remarks

C1

multilayer ceramic chip capacitor

6.8 pF

ATC 100B

C2

multilayer ceramic chip capacitor

20 pF

ATC 100B

C3

multilayer ceramic chip capacitor

39 pF

ATC 100A

C4

multilayer ceramic chip capacitor

43 pF

ATC 100A

C5

multilayer ceramic chip capacitor

6.2 pF

ATC 100B

C6

multilayer ceramic chip capacitor

10 pF

ATC 100B

C7

multilayer ceramic chip capacitor

15 pF

ATC 100B

C8, C12

multilayer ceramic chip capacitor

22 pF

ATC 100B

C9, C13

multilayer ceramic chip capacitor

1 nF

ATC 100B

C10, C14

multilayer ceramic chip capacitor

0.1

F

GRM21BR71H104KA01L

C11, C15

multilayer ceramic chip capacitor

1

F

GRM32RR71H105KA01L

C16

Electrolytic capacitor

1000

F,

63 V

L1

Wire wound inductor

43 nH

LQW18AN43NG80

L2

Inductor air core

~53 nH

R1

SMD

10



Size: 0603 (1608 metric)

amp01864

C1

C2

C3

C4

C5

C7

C8

C9

R1

L1

L2

C16

C6

C12

C13

C10

C11

C14

C15

106 mm

68 mm