Nexperia

ES3DP

200 V, 3 A hyperfast PN-rectifier

ES3DP

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Product data sheet

3 August 2017

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9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

150

K/W

Rth(j-a)

thermal resistance

from junction to

ambient

in free air

[2]

-

-

95

K/W

Rth(j-sp)

thermal resistance

from junction to solder

point

[3]

-

-

10

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Soldering point of cathode tab.

aaa-026980

10

1

102

103

Zth(j-a)

(K/W)

10-1

tp (s)

10-3

102

103

10

1

10-2

10-1

duty cycle = 1

0.75

0.33

0.25

0.05

0.02

0.01

0

0.20

0.10

0.50

FR4 PCB, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-026982

10

1

102

103

Zth(j-a)

(K/W)

10-1

tp (s)

10-3

102

103

10

1

10-2

10-1

duty cycle = 1

0.20

0.75

0.33

0.25

0.05

0.02

0.01 0

0.10

0.50

FR4 PCB, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values