ADL5370

Rev. 0 | Page 19 of 20

OUTLINE DIMENSIONS

*COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2

EXCEPT FOR EXPOSED PAD DIMENSION

1

24

6

7

13

19

18

12

*2.45

2.30 SQ

2.15

0.60 MAX

0.50

0.40

0.30

0.30

0.23

0.18

2.50 REF

0.50

BSC

12° MAX

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.00

BSC SQ

PIN 1

INDICATOR

0.60 MAX

COPLANARITY

0.08

0.20 REF

0.23 MIN

EXPOSED

PAD

(BOTTOMVIEW)

Figure 40. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-24-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Ordering Quantity

ADL5370ACPZ-R21

–40°C to +85°C

24-Lead LFCSP_VQ, 7”Tape and Reel

CP-24-2

250

ADL5370ACPZ-R71

–40°C to +85°C

24-Lead LFCSP_VQ, 7”Tape and Reel

CP-24-2

1,500

ADL5370ACPZ-WP1

–40°C to +85°C

24-Lead LFCSP_VQ, Waffle Pack

CP-24-2

64

ADL5370-EVALZ1

Evaluation Board