CS5302

http://onsemi.com

2

25.5 k

4.32 k

12.7 k

Q6

+

+

+

Q5

Q7

Q8

470 nH

1.0 k

0.1 μF

.01 μF

COMP

CS1

CS2

PWRGD

N/C

REF

Gate(H)2

GND2

Gate(L)2

SS

LGND

GATE(H)1

GND1

GATE(L)1

25.5 k

7.5 k

1.0 nF

1.0 nF

61.9 k

PWRGD

1.0 μF

ENABLE

+12 V

0.1 μF

.01 μF

25.5 k

.01 μF

Q1

Q3

Q4

470 nH

Q2

+5.0 V

1.0 μF

300 nH

6SP680M

8 ×

4SP820M

12 ×

10 μF cer

Figure 1. Application Diagram, 5.0 V to 1.6 V, 35 A Converter

ABSOLUTE MAXIMUM RATINGS*

Rating

Value

Unit

Operating Junction Temperature

150

°C

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

Storage Temperature Range

−65 to +150

°C

ESD Susceptibility (Human Body Model)

2.0

kV

1. 60 second maximum above 183°C.

*The maximum package power dissipation must be observed.

ABSOLUTE MAXIMUM RATINGS

Pin Name

Pin Symbol

Power for Logic

16 V

−0.3 V

N/A

50 mA

Power for Gate(L)1

16 V

−0.3 V

N/A

1.5 A, 1.0 μs 200 mA DC

Power for Gate(L)2

16 V

−0.3 V

N/A

1.5 A, 1.0 μs 200 mA DC

Power Gate(H)1

20 V

−0.3 V

N/A

1.5 A, 1.0 μs 200 mA DC

Power for Gate(H)2

20 V

−0.3 V

N/A

1.5 A, 1.0 μs 200 mA DC

Power Good Output

PWRGD

6.0 V

−0.3 V

1.0 mA

20 mA