AD8000

Rev. 0 | Page 17 of 20

OUTLINE DIMENSIONS

0.25 (0.0098)

0.17 (0.0068)

0.25 (0.0098)

0.10 (0.0039)

1.27 (0.050)

0.40 (0.016)

0.50 (0.020)

0.25 (0.010)

1.75 (0.069)

1.35 (0.053)

SEATING

PLANE

4

1

5.00 (0.197)

4.90 (0.193)

4.80 (0.189)

4.00 (0.157)

3.90 (0.154)

3.80 (0.150)

1.27 (0.05)

BSC

6.20 (0.244)

6.00 (0.236)

5.80 (0.228)

0.51 (0.020)

0.31 (0.012)

COPLANARITY

0.10

TOP VIEW

2.29 (0.092)

BOTTOM VIEW

(PINS UP)

2.29 (0.092)

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

COMPLIANT TO JEDEC STANDARDS MS-012

× 45°

8°

0°

85

Figure 54. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body (RD-8-1)

Dimensions shown in millimeters and (inches)

1

EXPOSED

PAD

(BOTTOM VIEW)

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50

REF

0.50

0.40

0.30

0.25

MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

1.90

1.75

1.60

4

1.60

1.45

1.30

3.00

BSC SQ

5

8

Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body (CP-8-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Minimum Ordering Quantity

Temperature Range

Package Description

Branding

Package Option

AD8000YRDZ1

1

–40°C to +125°C

8-Lead SOIC/EP

RD-8-1

AD8000YRDZ-REEL1

2,500

–40°C to +125°C

8-Lead SOIC/EP

RD-8-1

AD8000YRDZ-REEL71

1,000

–40°C to +125°C

8-Lead SOIC/EP

RD-8-1

AD8000YCPZ-R21

250

–40°C to +125°C

8-Lead LFCSP

HNB

CP-8-2

AD8000YCPZ-REEL1

5,000

–40°C to +125°C

8-Lead LFCSP

HNB

CP-8-2

AD8000YCPZ-REEL71

1,500

–40°C to +125°C

8-Lead LFCSP

HNB

CP-8-2