AD8336ACPZ-R7 datasheet(25/28 Pages) AD

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AD8336

Rev. 0 | Page 25 of 28

EVALUATION BOARD

An evaluation board, AD8336-EVALZ, is available online for

the AD8336. Figure 82 is a photo of the board.

The board is shipped from the factory, configured for a preamp

gain of 4×. To change the value of the gain of the preamp or the

gain polarity to inverting is a matter of changing component

values, or installing components in alternate locations provided.

All components are standard 0603 size, and the board is designed

for RoHS compliancy. Figure 83 shows the locations of

components provided for changing the amplifier configuration

to inverting gain. Simply install the components shown in red

and remove those in gray.

OPTIONAL CIRCUITRY

The AD8336 features differential inputs for the gain control,

permitting nonzero or floating gain control inputs. In order to

avoid any delay in making the board operational, the gain input

circuit is shipped with Pin GNEG connected to ground via a

0 Ω resistor in location R17. The user can simply adjust the gain

of the device by driving the GPOS test loop with a power supply

or voltage reference. Resistor networks are provided for fixed

gain bias voltages at Pin GNEG and Pin GPOS for common-

mode voltages other than 0 V. If it is desired to drive the gain

control with an active input such as a ramp, SMA connectors

can be installed in the locations GAIN− and GAIN+. Provision

is made for an optional SMA connector at PRVG for monitoring

the preamp output or driving the VGA from an external source.

Remove the 0 Ω resistor at R9 to isolate the preamp from an

external generator.

BOARD LAYOUT CONSIDERATIONS

The evaluation board uses four layers, with power and ground

planes located between two conductor layers. This arrangement

is highly recommended for customers and several views of the

board are provided as reference for board layout details. When

laying out a printed circuit board for the AD8336, remember to

provide a pad beneath the device to solder the exposed pad of

the matching device. The pad in the board should have at least

five vias in order to provide a thermal path for the chip scale

package. Unlike leaded devices, the thermal pad is the primary

means to remove heat dissipated within the device.

Table 6 is a bill of materials for the evaluation board.

Figure 82. AD8336 Evaluation Board

Figure 83. Components for Inverting Gain Operation

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