AD8387

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltages

AVCCx − AGNDx

18 V

DVCC − DGND

4.5 V

Input Voltages

Maximum Digital Input Voltage

DVCC + 0.5 V

Minimum Digital Input Voltage

DGND − 0.5 V

Maximum Analog Input Voltage

AVCC + 0.5 V

Minimum Analog Input Voltage

AGND − 0.5 V

Internal Power Dissipation1

4.38 W

Operating Temperature Range

0°C to 85°C

Storage Temperature Range

−65°C to +125°C

Lead Temperature Range (Soldering 10 sec)

300°C

Stresses above those listed under the Absolute Maximum

Ratings may cause permanent damage to the device. This is a

stress rating only; functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to the

absolute maximum ratings for extended periods may reduce

device reliability.

EXPOSED PADDLE

To ensure optimized thermal performance, the exposed paddle

must be thermally connected to an external plane, such as

AVCC or GND, as described in the Applications section.

OVERLOAD PROTECTION

The AD8387 overload protection circuit consists of an output

current limiter and a thermal switch.

When TSW is LOW, the thermal switch is disabled and the

output current limiter is enabled. The maximum current at any

one output is internally limited to 100 mA average. In the event

of a momentary short-circuit between a video output and a

power supply rail (VCC or AGND), the output current limit is

sufficiently low to provide temporary protection.

When TSW is HIGH, the output current limiter, as well as the

thermal switch, is enabled. The thermal switch debiases the

output amplifier when the junction temperature reaches the

internally set trip point. In the event of an extended short-

circuit between a video output and a power supply rail, the

output amplifier current continues to switch between 0 and

100 mA typical with a period determined by the thermal time

constant and the hysteresis of the thermal trip point. The

thermal switch, when enabled, provides long-term protection

from accidental shorts during the assembly process by limiting

the average junction temperature to a safe level.

MAXIMUM POWER DISSIPATION

The maximum power that the AD8387 can safely dissipate is

limited by its junction temperature. The maximum safe junction

temperature for plastic encapsulated devices, as determined by the

glass transition temperature of the plastic, is approximately 150°C.

Exceeding this limit temporarily can cause a shift in the parametric

performance due to a change in the stresses exerted on the die by

the package. Exceeding a junction temperature of 150°C for an

extended period can result in device failure.

OPERATING TEMPERATURE RANGE

To ensure operation within the specified operating temperature

range, it is necessary to limit the maximum power dissipation as

follows.

STILL AIR

200LFM

500LFM

1.0

3.0

50

55

60

65

70

75

80

85

90

100

95

75

80

85

90

95

100

105

110

115

125

120

AMBIENT TEMPERATURE (

°C)

THERMAL

SWITCH

DISABLED

ENABLED

2.5

2.0

1.5

QUIESCENT

Figure 3. Maximum Power Dissipation vs. Temperature,

AD8387 on a 4-Layer JEDEC PCB with Thermally Optimized Landing

Pattern as Described in the Applications Section

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.