MC44BS374T1/374T1A Advance Information

Packaging Instructions

21 Packaging Instructions

Tape and reel packaging per 12MRH00360A issue Y with the following conditions applicable for Dual In-

Line SOP (SOIC) package.

Figure 17. Dual In-line SOP (SOIC)

Component Orientation: Arrange parts with the pin 1 side closest to the tape's round sprocket holes on the

tape's trailing edge.

22 Marking Instructions

Bar marked part way across Pin 1 end of package.

Bar width 10 to 20 mils, length to be at least four

times Bar width. Bar placement may extend across

chamfer and dimple areas.

Pin 1 Dot or Dimple

MCBS374T1

AWLYWW

•

1st line:

MCBS374T1 (Part number coded on 9 digits)

•

2nd line:

Assembly site code AW (2 digits) followed by the

wafer lot code L (1 digit),

year Y (1 digit) and

work week WW (2 digits)

Bar marked part way across Pin 1 end of package.

Bar width 10 to 20 mils, length to be at least four

times Bar width. Bar placement may extend across

chamfer and dimple areas.

Pin 1 Dot or Dimple

MCBS374T1A

AWLYWW

•

1st line:

MCBS374T1A (Part number coded on 10 digits)

•

2nd line:

Assembly site code AW (2 digits) followed by the

wafer lot code L (1 digit),

year Y (1 digit) and

work week WW (2 digits)

Freescale Semiconductor, Inc.

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