MDS 553 H

6

Revision 080404

ICS553

Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

“LF” denotes Pb (lead) free package.

While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)

result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial

applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary

environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any

circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or

critical medical instruments.

Part / Order Number

Marking

Shipping Packaging

Package

Temperature

ICS553MI

553MI

Tubes

8-pin SOIC

-40 to +85

°C

ICS553MIT

553MI

Tape and Reel

8-pin SOIC

-40 to +85

°C

ICS553MILF

553MILF

Tubes

8-pin SOIC

-40 to +85

°C

ICS553MILFT

553MILF

Tape and Reel

8-pin SOIC

-40 to +85

°C

INDEX

AREA

1 2

8

D

E

SEATING

PLANE

A1

A

e

- C -

B

.10 (.004)

C

C

L

H

h x 45

Millimeters

Inches

Symbol

Min

Max

Min

Max

A

1.35

1.75

.0532

.0688

A1

0.10

0.25

.0040

.0098

B

0.33

0.51

.013

.020

C

0.19

0.25

.0075

.0098

D

4.80

5.00

.1890

.1968

E

3.80

4.00

.1497

.1574

e

1.27 BASIC

0.050 BASIC

H

5.80

6.20

.2284

.2440

h

0.25

0.50

.010

.020

L

0.40

1.27

.016

.050

α

0

°

8

°

0

°

8

°