NXP Semiconductors

NTS0102

Dual supply translating transceiver; open-drain; auto direction sensing

2. New use of the TL package: Place PCB trace for soldering of the center pad based on PCB layout

recommendations for better mechanical connection and thermal conductivity. The PCB center pad can be

connect to GND or left floating.

• Trace under the GD package

1. Replacement of GD package: It is not best practice to have center pad over the trace but since the TL

package center pad is not connected to the silicon the risk is low. If there are multiple traces there could

be EMI and cross talk. In both cases the customer needs to evaluate risk.

2. New use of the TL package: Do not route traces under the package

NTS0102

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Product data sheet

Rev. 4.5 — 6 July 2023

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