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PLUS16R4DA 数据表(PDF) 10 Page - NXP Semiconductors |
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PLUS16R4DA 数据表(HTML) 10 Page - NXP Semiconductors |
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10 / 16 page ![]() Philips Semiconductors Programmable Logic Devices Product specification PLUS16R8D/-7 SERIES PAL devices 16L8, 16R8, 16R6, 16R4 September 10, 1993 45 DC ELECTRICAL CHARACTERISTICS 0 °C ≤ Tamb ≤ +75°C, 4.75 ≤ VCC ≤ 5.25V LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN TYP1 MAX UNIT Input voltage2 VIL Low VCC = MIN 0.8 V VIH High VCC = MAX 2.0 V VIC Clamp VCC = MIN, IIN = –18mA –0.8 –1.5 V Output voltage VCC = MIN, VIN = VIH or VIL VOL Low IOL = 24mA 0.5 V VOH High IOH = –3.2 mA 2.4 V Input current VCC = MAX IIL Low3 VIN = 0.40V –250 µA IIH High3 VIN = 2.7V 25 µA II Maximum input current VIN = VCC = VCCMAX 100 µA Output current VCC = MAX IOZH Output leakage VOUT = 2.7V 100 µA IOZL Output leakage VOUT = 0.4V –100 µA IOS Short circuit 4, 5 VOUT = 0V –30 –90 mA ICC VCC supply current VCC = MAX 160 180 mA Capacitance6 CIN Input VCC = 5V VOUT = 2.0V 8 pF CB I/O (B) VOUT = 2V, f = 1MHz 8 pF NOTES: 1. All typical values are at VCC = 5V, Tamb = +25°C. 2. All voltage values are with respect to network ground terminal. 3. Leakage current for bidirectional pins is the worst case of IIL and IOZL or IIH and IOZH. 4. Test one at a time. 5. Duration of short circuit should not exceed 1 second. 6. These parameters are not 100% tested but periodically sampled. |
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