SPECIFICATION AND PERFORMANCE

SERIES:

104D-TCA0-R06

FILE:

104D-TCA0-R06_spec

DATE:

2014/01/09

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -

Durability

Contact Resistance:

100mΩ(Max)

No Damage

Solder connectors on PCB, then place them

on the pull-push machine, and repeat

mating and un-mating 10,000cycles

repeatedly at a rate of

400~600 cycles/hour.

(EIA364-09)

Vibration

Finish

1. No electrical

discontinuity more

than 0.1μs.

2 .No Damage

3.Contact Resistance

100mΩ(Max)

Mate dummy card and subject to the

following vibration conditions, for a period of

30 minutes in each of 3 mutually

perpendicular axis, passing DC 1 mA during

the test.

Amplitude: 1.52 mm P-P or 19.6 m/s2

Frequency: 10-55-10Hz

Shall be traversed in 1minute.

(MIL-STD-202 METHOD 201)

Shock

Finish

1. No electrical

discontinuity more

than 0.1μs.

2 .No Damage

3.Contact Resistance

100mΩ(Max)

Solder connectors on PCB and mate them

together, subject to he following shock

conditions, 3 shocks shall be period along 3

mutually perpendicular axis, passing DC

1mA current during the test.

1 axis, plus-minus direction, core 3 times.

(total:18times) 490m/s2

(MIL-STD-202 METHOD 213)

Card Insertion / Eject

Force

9.8N(Max)

Push the card at the speed rate 25 ± 3

mm/minute.

Card Release Force

4N+/-1N

From the state of the card lock, Pull the card

at the speed rate 25 ± 3 mm/minute.

Push in strength

No Damage

The card inserted in positive and the

opposite direction and the load of 30N is

added