The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.

本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -

(MIL-STD-202 METHOD 213)

ENVIRONMENTAL

Item

Requirement

Test Condition

Humidity Test

Finish

1. Contact Resistance:

50mΩ Max.

2. Insulation Resistance:

100MΩ Min.

Humidity storage at 40±3°C with

90±5% RH for 96 hours.

(EIA364-31)

Salt Mist Test

Finish

1. Contact Resistance:

50mΩ Max.

2 .No Damage

5±1% salt solutions, at 35±2°C

duration 24 hours.

Connectors detached

(MIL-STD-1344)

Thermal Shock

Finish

1. Contact Resistance:

50mΩ Max.

2. Insulation Resistance:

100MΩ Min.

Test time: 5 cycles

(MIL-STD-202 METHOD 107)

Stage

Temp

Time

t1

-55±5°C

30 min

t2

-55±5°C~+85±5°C

5 min

t3

+85±5°C

30 min

t4

+85±5°C~-55°C±5°C

5 min

Heat Resistance

Finish

1. Contact Resistance:

50mΩ Max.

2. Insulation Resistance:

100MΩ Min.

Solder connectors on PCB and mate

them together, expose to 85±2°C for

48hrs. Upon completion of the exposure

period, the test specimens shall be

conditioned at ambient room conditions

for 1 of 2hrs, after which the specified

measurements shall be performed.

(MIL-STD-202 METHOD 108)

t1

t2

t3

t4