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STTH212 数据表(PDF) 5 Page - STMicroelectronics |
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STTH212 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() STTH212 1 Electrical characteristics 5/9 Figure 11. Transient peak forward voltage versus dIF/dt (typical values) Figure 12. Forward recovery time versus dIF/dt (typical values) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance versus lead length Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, eCU = 35µm) Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, ecu = 35 µm) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 1020 30 4050 60 70 8090 100 V (V) FP I F=I F(AV) T j=125°C dl /dt(A/µs) F 200 220 240 260 280 300 320 340 360 380 400 420 0 20 40 60 80 100 t (ns) FR I F=I F(AV) V FR =1. 1 x V F max. T j=125°C dl /dt(A/µs) F 1 10 100 1 10 100 1000 C(pF) V (V) R F=1MHz Vosc=30mVRMS Tj=25°C 0 10 20 30 40 50 60 70 80 90 100 5 1015 2025 R (°C/W) th(j-a) L (mm) Leads DO201-AD Rth(j-a) Rth(j-l) 0 10 20 30 40 50 60 70 80 01 2345 678 9 10 R (°C/W) th(j-a) S (cm ) Cu 2 DO-201AD 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm ) Cu 2 SMB SMC |
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