MP6606

– 60V, 8-CHANNEL LOW-SIDE DRIVER WITH SERIAL INTERFACE

MP6606 Rev. 1.0

MonolithicPower.com

4

3/11/2022

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ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ..................... -0.3V to +65V

OUTx voltage (VOUTx) ................... -0.7V to +65V

Clamp voltage (VCLAMP) ................ -0.7V to +65V

All other pins to GND .................. -0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (2)

..................................................................3.1W

Storage temperature ................ -55°C to +150°C

Junction temperature ............................... 150°C

Lead temperature (solder) ....................... 260°C

ESD Ratings

Human body model (HBM)

……………….. ±2kV

Ch

arged device model (CDM) …………… ±2kV

Recommended Operating Conditions (3)

Supply voltage (VIN) ........................ 4.5V to 60V

Output voltage (VOUTx)...........................0 to 60V

Maximum output current for low-side FETs (ILSX)

……………..............................................750mA

Maximum output current for high-side diodes

(IHSX) …………….…750mA at duty cycles <20%

Operating junction temp (TJ). ... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

TSSOP-20EP

…………………..40........8....°C/W

Notes:

1)

Exceeding these ratings may damage the device.

2)

The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θJA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) /

θJA. Exceeding the maximum

allowable power dissipation can produce an excessive die

temperature, and the regulator may go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage.

3)

The device is not guaranteed to function outside of its

operating conditions.

4)

Measured on JESD51-7, 4-layer PCB.