Data Sheet

ADL5308

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 22

Table 3. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage (VCC)

5.5 V

Current into INP

100 mA

Current into IREF

25 mA

DC Voltage

SUM, INP, IREF, SDA, SCL

−0.3 V to 3.6 V

CREF, CMP, VLOG, HYST

−0.3 V to 3.6 V

PDB

−0.3 V to VCC + 0.3 V

Output Short-Circuit Current Duration

VLOG, CMP, PDB

Indefinite

Temperature

Ambient Operating Range

−40°C to +105°C

Storage Range

−65°C to +150°C

Lead (Soldering, 60 sec)

300°C

Maximum Junction (TJ)

135°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

Table 4. Thermal Resistance

Package Type1

θJA2

θJB3

θJC4

Unit

CC-14-4

86

45

32

°C/W

1 Test Condition 1: thermal impedance simulated values are based upon use of

2S2P JEDEC PCB. For more information, see the Ordering Guide section.

2 θJA is the natural convection junction-to-ambient thermal resistance measured

in a one cubic foot sealed enclosure.

3 θJB is the junction-to-board thermal resistance.

4 θJC is the junction-to-case bottom thermal resistance.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.