7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Input voltage

VIN

–0.3

6.5

V

Enable voltage

EN

–0.3

VIN + 0.3 (2)

V

Output voltage

VREF

–0.3

VIN + 0.3 (2)

V

Output short circuit current

ISC

20

mA

Operating temperature range

TA

–55

125

°C

Storage temperature range

Tstg

–65

170

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

IN + 0.3 V or 6.5 V, whichever is lower

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins (1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC

JS-002, all pins (2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage (1)

VREF+ VDO (2)

6

V

EN

Enable voltage

0

VIN

V

IL

Output current

–5

10

mA

TA

Operating temperature

–40

25

125

°C

(1)

For VREF = 1.2 V and 1.25 V, minimum VIN = 1.7 V

(2)

VDO = Dropout voltage

7.4 Thermal Information

THERMAL METRIC(1)

REF35-Q1

UNIT

DBV (SOT-23)

6 PINS

RθJA

Junction-to-ambient thermal resistance

164.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

102.5

°C/W

RθJB

Junction-to-board thermal resistance

59.6

°C/W

ΨJT

Junction-to-top characterization parameter

44.0

°C/W

ΨJB

Junction-to-board characterization parameter

59.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

REF35-Q1

SNAS845 – AUGUST 2023

www.ti.com

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