7.6 Typical Characteristics (continued)

at TA = 25°C, VIN = VEN = VREF + 0.3 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted)

Temperature (

C)

-40

-7

26

59

92

125

0

40

80

120

160

200

IL = 10 mA

IL = 5 mA

IL = 1 mA

IL = 0.1 mA

IL = 0 mA

Figure 7-25. Dropout Voltage vs Free-Air Temperature

Solder Heat Shift %

0

12

24

36

48

60

-0.03

-0.02

-0.01

0

0.01

0.02

0.03

Figure 7-26. Solder Heat Shift Distribution

Time (hr)

0

200

400

600

800

1000

-200

-100

0

100

200

Figure 7-27. Long Term Stability - 1000 hours (VREF)

REF35-Q1

SNAS845 – AUGUST 2023

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