数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

MPC5565 数据表(PDF) 8 Page - Freescale Semiconductor, Inc

部件名 MPC5565
功能描述  Microcontroller
PDF  48 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MPC5565 数据表(HTML) 8 Page - Freescale Semiconductor, Inc

Back Button MPC5565 Datasheet HTML 4Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 5Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 6Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 7Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 8Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 9Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 10Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 11Page - Freescale Semiconductor, Inc MPC5565 Datasheet HTML 12Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 8 / 48 page
background image
MPC5565 Microcontroller Data Sheet, Rev. 0
Preliminary—Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
8
where:
TT = thermocouple temperature on top of the package (oC)
ΨJT = thermal characterization parameter (oC/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled
Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal
Resistance and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego,
1999, pp. 212–220.
3.3
Package
The MPC5565 is available in packaged form. Package options are listed in Section 2, “Ordering
Information.”
Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications1
Num
Characteristic
Min. Value
Typ. Value
Max. Value
Unit
1
Scan Range
0.15
1000
MHz
2
Operating Frequency
132
MHz
3VDD Operating Voltages
1.5
V



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com