CS5211

http://onsemi.com

2

COMP

GATE(H)

GATE(L)

PGND

IS−

CS5211

2.5 V/8.0 A

51 k

0.1 mF

LGND

100 mF/10 V × 3

0.1 mF

SENSE+

4.7 k

1.0 k

1.0%

2.9 mH

5.0 V

IS+

SENSE−

+

+

100 mF/10 V × 2

SGND

1.0%

0.1 mF

0.1 mF

10

BST

4.7 k

Figure 1. Application Diagram, 5.0 V to 2.5 V/8.0 A Converter with Differential Remote Sense

10

1.5 k

0.1 mF

Return

680 pF

ORDERING INFORMATION

Device

Operating Temperature Range

Package

CS5211ED14

SOIC−14

55 Units / Rail

CS5211ED14G

SOIC−14

(Pb−Free)

55 Units / Rail

CS5211EDR14

SO−14

2500 / Tape & Reel

CS5211EDR14G

SOIC−14

(Pb−Free)

2500 / Tape & Reel

CS5211GD14

SO−14

55 Units / Rail

CS5211GD14G

SOIC−14

(Pb−Free)

55 Units / Rail

CS5211GDR14

SO−14

2500 / Tape & Reel

CS5211GDR14G

SOIC−14

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MAXIMUM RATINGS

Rating

Value

Unit

150

°C

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

−65 to +150

°C

30

125

°C/W

°C/W

ESD Susceptibility (Human Body Model)

2.0

kV

JEDEC Moisture Sensitivity

1.0

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. 60 second maximum above 183°C.