Nexperia

PUSB3CB4

Extremely low capacitance bidirectional ESD protection diode array

9. Soldering

SOT1176-2

Footprint information for reflow soldering of DFN2510A-10 package

Hx

By

Hy

0.05

C

P

D

0.05

Ay

Dimensions in mm

Ay

By

C

D

Hy

1.25

0.3

0.475

0.2

P

0.5

1.5

Hx

2.45

Generic footprint pattern

Refer to the package outline drawing for actual layout

recommended stencil thickness: 0.1 mm

sot1176-2_fr

occupied area

solder paste

solder resist

solder land

Issue date 21-07-05

Fig. 2. Reflow soldering footprint for DFN2510A-10 (SOT1176-2)

PUSB3CB4_SDS

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Nexperia B.V. 2023. All rights reserved

Short data sheet

8 August 2023

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